Japan's Fujifilm launches ZEMATES PFAS-free polyimide for chips

The ZEMATES product lineup consists of liquid-type polyimide for redistribution layers (RDL) and protective films, film-type polyimide for redistribution layers and PBO (polybenzoxazole) for use in protective films. These products are used as insulating layer materials in semiconductor packaging processes, covering a wide range from power semiconductors to high-performance AI semiconductors. These products, which combine excellent heat resistance and insulation properties, have earned a strong reputation for reliability. With a supply system based in Japan, the United States, and Europe, sales to semiconductor manufacturers around the world are expanding, and inquiries from new customers continue to grow.

In recent years, as the demand for improved performance and lower power consumption in semiconductors—including AI semiconductors—has increased, the need for advanced packaging that integrates multiple chips has also grown. Within this trend, the market for photosensitive insulating materials used as interlayer dielectrics in redistribution layers, which contribute to wiring miniaturization, planarization, low thermal expansion, and low dielectric constant, is expected to achieve significant growth at an annual rate of 15%.

Going forward, efforts will focus on further expanding sales of liquid-type polyimide as the core product, while also aiming for the early market launch of film-type polyimide developed using Fujifilm’s precision coating technology. Building on the trust earned from customers through liquid-type polyimide, the goal is to expand sales of photosensitive insulating materials to five times the level of FY2024 by FY2030.

The newly developed film-type polyimide is now compatible with PLP (panel-level packaging process), which is required for finer wiring and larger substrates in build-up substrates, and is expected to expand its applications from interposers, where liquid-type is currently used, to build-up substrates. The use of film-type polyimide enables planarization of insulating layers, suppressing surface irregularities and undulations associated with multilayer build-up substrates, thereby contributing to improved production efficiency and product quality. Notably, all polyimide products are PFAS-free, containing no per- or polyfluoroalkyl substances, which are of increasing environmental concern.

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ALCHEMPro News Desk (MS)