Oerlikon sells VERSALINE system to Cornell University
01 Nov '07
2 min read
Oerlikon Systems recently announced that the Cornell University Nanoscale Science and Technology Facility (CNF) in Ithaca, New York has purchased a VERSALINE deep silicon dry etching system.
This VERSALINE system will bring new processing capability for MEMS device fabrication as well as enabling a broad range of nanoscale science and technology projects. The system incorporates Oerlikon's latest Deep Silicon Etch (DSE) technology that provides the etching precision and process latitude necessary to create the next generation of nanoscale and MEMS devices.
The Cornell Nanoscale Science & Technology Facility is a national user facility that provides state-of-the-art resources coupled with expert staff as part of the National Nanofabrication Infrastructure Network (NNIN).
This year marks CNF's 30th year in operation. Research at CNF encompasses physical sciences, engineering, and life sciences, and has a strong inter-disciplinary emphasis. Over 700 users per year (50% of them come from outside Cornell) use the fabrication, synthesis, computation, characterization, and integration resources of CNF to build structures, devices and systems from atomic to micron length-scales. Dry etching of silicon is one of the critical processes for research in these areas.
“After an extensive and detailed evaluation of the available deep silicon etch technology, Oerlikon's VERSALINE DSE performanceoffered the best combination of outstanding process latitude, mask selectivity, and high etch rate we require to meet the needs of our numerous user projects,” stated Don Tennant, Directory of Operations at CNF.
marketing@alchempro.com
